A GLOBAL VIRTUAL FOUNDRY EVENT
Join us for Samsung Foundry’s first-ever, global, virtual SAFE™ conference. While attending the event, you’ll have an opportunity to hear directly from Samsung and thought-leaders from across the industry who are at the forefront of advanced chip design and manufacturing. Learn how these next-generation chips are powering innovation across multiple market applications including HPC, AI, 5G, IoT, and Automotive.
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2019 EVENT DETAILS
LOCATION
Check-in will be in the South Lobby starting at 9:30am. Attendees must register online prior to arrival.
REGISTRATION
Oct 17th, 2019
9:30 AM - 7:00 PM
DATE & TIME
2019 EVENT SCHEDULE
Parking provided on location in the parking garage. $20 Lyft vouchers for the first 200 people to register.
PARKING
QUESTIONS?
For questions about SAFE™ Forum please feel free to send a message and we'll respond right away - typically within 24 hrs.
"Gain insight.
Get connected.
Leave inspired."
CAPACITY
We have a limited number of seats so don't wait to register!
There is no onsite registration for the event. Registration through this site only.
Hear directly from Foundry industry leaders on designing next-generation chips.
Time until event:
03 : 00 : 00 : 00
Time until event:
9:30 am - Registration
10:30 am - Sessions
5:10 Pm - Networking Reception
| May 14th | |
| 1:00pm-2:00pm | Registration |
| 2:00pm-2:35pm | Welcome & Keynotes |
| 2:35pm-3:25pm | Session 1: Technology & Innovation |
| 3:25pm-3:40pm | Break |
| 3:40pm-4:10pm | Session 2: Foundry Platform Solutions |
| 4:10pm-5:20pm | Session 3: Customer Panel |
| 5:20pm-5:30pm | Close Event |
| 5:30pm-7:00pm | Networking Reception |
SPEAKERS
Rob Knoth
Speaker TBD
Lee Harrison
John Park
Sooyong Kim
Stewart Williams
Director, Marketing, Cadence
Speaker TBD
Automotive IC Test Marketing Manager, D2S Tessent Marketing, Mentor
Product Management Director, Advanced Semiconductor Packaging, Cadence
Senior product manager, 3D-IC and chip-package-system multiphysics solutions, ANSYS
Automotive Vertical Marketing Manager, Design Group, Synopsys
SAFE
Registration & Partner Pavilion
9:30-10:30
---
9:30-10:30
10:30-11:40
11:40-12:40
Lunch & Partner Pavilion
11:40-12:40
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12:40-1:40
Critical IPs Enabling Next-Gen HPC & AI Platforms
Learn from SAFE partners how to achieve maximum performance and efficiency for DC/ML/AI, from 112G and HBM to memory compilers.
HPC TRACK
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12:40-1:40
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Addressing Safety and Reliability Requirements in the Automotive Space
Learn more about Samsung EDA partners’ methodology and switches to meet ISO 26262 and AEC-Q100 requirements.
AUTO & IoT TRACK
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12:40-1:40
---
1:40-1:50
BREAK
1:50-2:50
Innovative Advanced EDA Solutions for HPC and AI Platforms
Learn about flows and methodologies for on/off-chip SI/PI analysis and multi-die integration for HPC and AI platforms available only from Samsung Foundry.
HPC TRACK
---
1:50-2:50
---
What Does ISO, ASIL & AEC-Q100 IPs Have to do With Auto Design?
Learn what IPs and which IPs (ASIL & AEC-Q100) can help you to accelerate your ISO26262 automotive design and certificates.
AUTO & IoT TRACK
---
1:50-2:50
---
2:50-3:00
BREAK
3:00-4:00
New Reference Flows for Arm's CPU & PDK for Upcoming Process Nodes
Discover EDA Reference flow for the next -generation Arm processor and PDK solution for enhancing physical verification turn-around-time and reducing modeling effort.
HPC TRACK
---
3:00-4:00
---
Think IoT
Discover a new-generation of IoT and Edge computing platforms with actual implementations from Arm to RISC-V based platforms.
AUTO & IoT TRACK
---
3:00-4:00
---
4:00-4:10
BREAK
4:10-5:10
Building the Next-Gen Packaging for a New ERA
Discover innovative solutions in advanced packaging targeting HPC/AI and 5G/IoT/Automotive systems.
PACKAGING TRACK
---
4:10-5:10
---
Secure Design Implementations with Cloud & Samsung Security
Learn about cloud based design implementations and Samsung Security
CLOUD SERVICE & SAMSUNG SECURITY TRACK
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4:10-5:10
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HIGH-PERFORMANCE COMPUTING TRACK
AUTOMOTIVE & IoT TRACK
5:10-7:00
Networking Happy Hour & Partner Pavilion
5:10-7:00
---
END FORMAL PROGRAM
BEGIN FORMAL PROGRAM
Cloud Service & Samsung Security Track
PACKAGING TRACK
3DIC Solution Architect Director, Product Marketing, Synopsys
Youngsoo Lee
K.B. Lee
Solution Architect, Cadence
Director, Product Engineering Snr Group, Cadence
Lokesh Korlipara
Neeraj Kaul
Vice President of R&D, Physical Design Technology and Tools, Synopsys
Frederic Renoux
Executive Vice President of Sales, Dolphin Design
Brandon Cho
CEO, SemiFive
John Ferguson
Product Marketing Director, DRC, Calibre Design Solutions, Mentor
Sr. Manager Product Marketing, ARM
Umang Doshi
Rishi Chugh
Vice President of IP Marketing, Cadence
Director of Memory Interface IP Product Management, Rambus
Frank Ferro
Director of Marketing, Cadence
Thomas Wong
John Koeter
VP, Marketing of IP, Synopsys
Head of SoC Engineering, Dream Chip
Martin Zeller
Prashant Varshney
Sr. Director, Product Management, Azure
Richard Ord
VP Business Development, Sondrel
Senior Solution Marketing Manager of PDG, ARM
Phil Morris
Jaehong Park, Ph. D
EVP, Head of Design Platform Development, Samsung Foundry
David Pellerin
Head of Global Business Development, Semiconductor, AWS
Director, Security IP/Digital IP Group, Samsung
Mijung Noh
Corporate Vice President, Design Technology Team, Samsung Foundry
Jung Yun Choi (Ph. D)
Michael Choi (Ph. D)
Master, IP Development Team, Samsung Foundry
Pete Bannon
VP of Low Voltage and Silicon Engineering, Tesla
Max Min
Director, Samsung Foundry, Samsung
WW VP of FAE, JCET
Chris Scanlan
Mike Kelly
VP Advance Package & Technology Integration, AMKOR
Samsung
Time until event:
Time until event:
OCTOBER 28, 2020
9:30 am - Registration
10:30 am - Sessions
5:10 Pm - Networking Reception
SAMSUNG FOUNDRY
SAFE™ FORUM
Foundry SAFE ™ Forum
Oct. 17th
Samsung@First Campus
SAMSUNG FOUNDRY
PARTNERING FOR A BOLD SILICON FUTURE
9:30 am - Registration
10:30 am - Sessions
5:10 Pm - Networking Reception
Virtual
VIRTUAL
October 28 | Virtual |
SAFE
How to Optimize Your Time During This Event
Watch this quick video from SwapCard on how to plan ahead, attend keynotes and relevant technical sessions, book meetings, and get the most out of this event.
Foundry Forum
Oct 27, 2020
Samsung's Perspective of the Future
Technology Leadership
External Thought Leadership
Manufacturing Excellence
10 AM - 12:00 PM
Advanced Technology Updates
Foundry Specialty Updates
Advanced Packaging Updates
Fireside Chat
What to Expect on Day 2
SAFE™ Forum
Oct 28, 2020
Jae Hong Park, Samsung Foundry: Designing Your Future with SAFE
Raja Koduri, Intel: 1000X More Compute for AI by 2025
Lip-Bu Tan, Cadence: AI and Data-Centric Trends and Opportunities
Joe Sawicki, Mentor: Pervasive Digitalization of Everything, Based on Ever Increasing Complexity of Silicon
Starts at 10am PT with on-demand technical sessions opening at 12pm.
Chi-Foon Chan, Synopsys: Trusted Partnerships in a New Era of Heterogenous Integration
Panel Session: Heterogeneous Integration Technology: Is This the New Norm?
Panel Session: PPA Optimization for Performance Platforms
Thank you! You’re Invited to Explore the On-Demand Content.
DAY 1
SCHEDULE
Hear directly from Samsung Foundry and industry technology leaders on process technology innovations that are powering the silicon universe in the areas of AI, High-Performance Computing, 5G, IoT and Automotive.
Foundry Forum
Oct 27 | 10 AM -12:00 PM
From Design Enablement and IP to Advanced Packaging and Design Services, Samsung Foundry’s SAFE partner ecosystem is enabling cutting-edge chip designs on the most advanced process nodes.
SAFE™ Forum
Starts at 10am PT with on-demand technical sessions opening at 12pm.
Jaehong Park, PH.D.
EVP Head of Design Platform Development
SAMSUNG FOUNDRY
Hear directly from Foundry industry leaders on designing next-generation chips.
Forum
2020
Forum
2020
™
Design Your Future with SAFE™
PRIZES!
Participate to win raffle prizes. The greater your participation, the greater your chances!
